JPS50117763U - - Google Patents

Info

Publication number
JPS50117763U
JPS50117763U JP1974027573U JP2757374U JPS50117763U JP S50117763 U JPS50117763 U JP S50117763U JP 1974027573 U JP1974027573 U JP 1974027573U JP 2757374 U JP2757374 U JP 2757374U JP S50117763 U JPS50117763 U JP S50117763U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1974027573U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974027573U priority Critical patent/JPS50117763U/ja
Publication of JPS50117763U publication Critical patent/JPS50117763U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1974027573U 1974-03-09 1974-03-09 Pending JPS50117763U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974027573U JPS50117763U (enrdf_load_stackoverflow) 1974-03-09 1974-03-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974027573U JPS50117763U (enrdf_load_stackoverflow) 1974-03-09 1974-03-09

Publications (1)

Publication Number Publication Date
JPS50117763U true JPS50117763U (enrdf_load_stackoverflow) 1975-09-26

Family

ID=28129903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974027573U Pending JPS50117763U (enrdf_load_stackoverflow) 1974-03-09 1974-03-09

Country Status (1)

Country Link
JP (1) JPS50117763U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635448A (en) * 1979-08-30 1981-04-08 Nec Corp Semiconductor device
JPS60182752A (ja) * 1984-02-29 1985-09-18 Hitachi Ltd 樹脂被覆電子装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS432113Y1 (enrdf_load_stackoverflow) * 1964-11-11 1968-01-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS432113Y1 (enrdf_load_stackoverflow) * 1964-11-11 1968-01-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635448A (en) * 1979-08-30 1981-04-08 Nec Corp Semiconductor device
JPS60182752A (ja) * 1984-02-29 1985-09-18 Hitachi Ltd 樹脂被覆電子装置の製造方法

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