JPS5011663A - - Google Patents
Info
- Publication number
- JPS5011663A JPS5011663A JP48060876A JP6087673A JPS5011663A JP S5011663 A JPS5011663 A JP S5011663A JP 48060876 A JP48060876 A JP 48060876A JP 6087673 A JP6087673 A JP 6087673A JP S5011663 A JPS5011663 A JP S5011663A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6087673A JPS5716501B2 (ja) | 1973-06-01 | 1973-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6087673A JPS5716501B2 (ja) | 1973-06-01 | 1973-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5011663A true JPS5011663A (ja) | 1975-02-06 |
| JPS5716501B2 JPS5716501B2 (ja) | 1982-04-05 |
Family
ID=13155006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6087673A Expired JPS5716501B2 (ja) | 1973-06-01 | 1973-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5716501B2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5292366A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Ceramic package circuit board |
| JPS57155750A (en) * | 1981-03-21 | 1982-09-25 | Nec Corp | Chip carrier structure |
-
1973
- 1973-06-01 JP JP6087673A patent/JPS5716501B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5292366A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Ceramic package circuit board |
| JPS57155750A (en) * | 1981-03-21 | 1982-09-25 | Nec Corp | Chip carrier structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5716501B2 (ja) | 1982-04-05 |