JPS50116284A - - Google Patents
Info
- Publication number
- JPS50116284A JPS50116284A JP50011487A JP1148775A JPS50116284A JP S50116284 A JPS50116284 A JP S50116284A JP 50011487 A JP50011487 A JP 50011487A JP 1148775 A JP1148775 A JP 1148775A JP S50116284 A JPS50116284 A JP S50116284A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US444219A US3867693A (en) | 1974-02-20 | 1974-02-20 | LSI chip test probe contact integrity checking circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50116284A true JPS50116284A (US06277897-20010821-C00009.png) | 1975-09-11 |
Family
ID=23763989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50011487A Pending JPS50116284A (US06277897-20010821-C00009.png) | 1974-02-20 | 1975-01-29 |
Country Status (5)
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2442571A1 (fr) * | 1978-11-21 | 1980-06-20 | Borovsky Nikolai | Dispositif de controle des parametres electriques des circuits electroniques |
| US4342958A (en) * | 1980-03-28 | 1982-08-03 | Honeywell Information Systems Inc. | Automatic test equipment test probe contact isolation detection method |
| US4342957A (en) * | 1980-03-28 | 1982-08-03 | Honeywell Information Systems Inc. | Automatic test equipment test probe contact isolation detection apparatus and method |
| EP0128986B1 (en) * | 1982-12-23 | 1991-02-27 | Sumitomo Electric Industries Limited | Monolithic microwave integrated circuit and method for selecting it |
| GB2149129B (en) * | 1983-11-04 | 1987-10-21 | Membrain Ltd | Automatic test equipment |
| US4646002A (en) * | 1984-05-10 | 1987-02-24 | Regents Of The University Of Minnesota | Circuit for high impedance broad band probe |
| US5565767A (en) * | 1992-04-16 | 1996-10-15 | Mega Chips Corporation | Base substrate of multichip module and method for inspecting the same |
| US5610530A (en) * | 1994-10-26 | 1997-03-11 | Texas Instruments Incorporated | Analog interconnect testing |
| EP0733910B1 (de) * | 1995-03-16 | 1996-12-11 | Siemens Aktiengesellschaft | Platine mit eingebauter Kontaktfühlerprüfung für integrierte Schaltungen |
| US6798224B1 (en) * | 1997-02-11 | 2004-09-28 | Micron Technology, Inc. | Method for testing semiconductor wafers |
| US5936419A (en) * | 1997-06-05 | 1999-08-10 | Extech Electronics Co., Ltd. | Test method and apparatus utilizing reactive charging currents to determine whether a test sample is properly connected |
| US6087841A (en) * | 1997-10-01 | 2000-07-11 | International Business Machines Corporation | Contact test circuit |
| US6731128B2 (en) | 2000-07-13 | 2004-05-04 | International Business Machines Corporation | TFI probe I/O wrap test method |
| JP2002033363A (ja) * | 2000-07-19 | 2002-01-31 | Hitachi Ltd | 半導体ウエハ、半導体チップ、および半導体装置の製造方法 |
| JP2005251784A (ja) * | 2004-03-01 | 2005-09-15 | Renesas Technology Corp | 半導体モジュールおよびその製造方法 |
| KR100657789B1 (ko) * | 2004-07-15 | 2006-12-14 | 삼성전자주식회사 | 유전막의 누설 전류 특성을 검사하는 방법 및 이를수행하기 위한 장치 |
| KR101274208B1 (ko) * | 2007-08-07 | 2013-06-17 | 삼성전자주식회사 | 접촉 불량 검출회로를 구비하는 반도체 장치 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506911A (en) * | 1965-10-24 | 1970-04-14 | Mallory & Co Inc P R | Apparatus for indicating relative alignment of engageable contacts using a printed circuit sensor |
| US3728616A (en) * | 1971-02-02 | 1973-04-17 | Western Electric Co | Continuity testing apparatus utilizing a plurality of paired resistors |
| US3721899A (en) * | 1971-10-06 | 1973-03-20 | Us Army | Continuity test and indicating circuit |
| US3746973A (en) * | 1972-05-05 | 1973-07-17 | Ibm | Testing of metallization networks on insulative substrates supporting semiconductor chips |
-
1974
- 1974-02-20 US US444219A patent/US3867693A/en not_active Expired - Lifetime
- 1974-12-27 FR FR7443566A patent/FR2261623A1/fr not_active Withdrawn
-
1975
- 1975-01-29 GB GB383975A patent/GB1451295A/en not_active Expired
- 1975-01-29 JP JP50011487A patent/JPS50116284A/ja active Pending
- 1975-01-31 DE DE19752504076 patent/DE2504076A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2261623A1 (US06277897-20010821-C00009.png) | 1975-09-12 |
| GB1451295A (en) | 1976-09-29 |
| DE2504076A1 (de) | 1975-08-21 |
| US3867693A (en) | 1975-02-18 |
