JPS50116174A - - Google Patents

Info

Publication number
JPS50116174A
JPS50116174A JP2144974A JP2144974A JPS50116174A JP S50116174 A JPS50116174 A JP S50116174A JP 2144974 A JP2144974 A JP 2144974A JP 2144974 A JP2144974 A JP 2144974A JP S50116174 A JPS50116174 A JP S50116174A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2144974A
Other languages
Japanese (ja)
Other versions
JPS5341064B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2144974A priority Critical patent/JPS5341064B2/ja
Publication of JPS50116174A publication Critical patent/JPS50116174A/ja
Publication of JPS5341064B2 publication Critical patent/JPS5341064B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP2144974A 1974-02-25 1974-02-25 Expired JPS5341064B2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2144974A JPS5341064B2 (en:Method) 1974-02-25 1974-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2144974A JPS5341064B2 (en:Method) 1974-02-25 1974-02-25

Publications (2)

Publication Number Publication Date
JPS50116174A true JPS50116174A (en:Method) 1975-09-11
JPS5341064B2 JPS5341064B2 (en:Method) 1978-10-31

Family

ID=12055259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2144974A Expired JPS5341064B2 (en:Method) 1974-02-25 1974-02-25

Country Status (1)

Country Link
JP (1) JPS5341064B2 (en:Method)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Also Published As

Publication number Publication date
JPS5341064B2 (en:Method) 1978-10-31

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