JPS50116174A - - Google Patents

Info

Publication number
JPS50116174A
JPS50116174A JP2144974A JP2144974A JPS50116174A JP S50116174 A JPS50116174 A JP S50116174A JP 2144974 A JP2144974 A JP 2144974A JP 2144974 A JP2144974 A JP 2144974A JP S50116174 A JPS50116174 A JP S50116174A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2144974A
Other languages
Japanese (ja)
Other versions
JPS5341064B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2144974A priority Critical patent/JPS5341064B2/ja
Publication of JPS50116174A publication Critical patent/JPS50116174A/ja
Publication of JPS5341064B2 publication Critical patent/JPS5341064B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP2144974A 1974-02-25 1974-02-25 Expired JPS5341064B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2144974A JPS5341064B2 (en) 1974-02-25 1974-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2144974A JPS5341064B2 (en) 1974-02-25 1974-02-25

Publications (2)

Publication Number Publication Date
JPS50116174A true JPS50116174A (en) 1975-09-11
JPS5341064B2 JPS5341064B2 (en) 1978-10-31

Family

ID=12055259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2144974A Expired JPS5341064B2 (en) 1974-02-25 1974-02-25

Country Status (1)

Country Link
JP (1) JPS5341064B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Also Published As

Publication number Publication date
JPS5341064B2 (en) 1978-10-31

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