JPS50113174A - - Google Patents
Info
- Publication number
- JPS50113174A JPS50113174A JP49017359A JP1735974A JPS50113174A JP S50113174 A JPS50113174 A JP S50113174A JP 49017359 A JP49017359 A JP 49017359A JP 1735974 A JP1735974 A JP 1735974A JP S50113174 A JPS50113174 A JP S50113174A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49017359A JPS5223218B2 (en) | 1974-02-13 | 1974-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49017359A JPS5223218B2 (en) | 1974-02-13 | 1974-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50113174A true JPS50113174A (en) | 1975-09-05 |
| JPS5223218B2 JPS5223218B2 (en) | 1977-06-22 |
Family
ID=11941835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49017359A Expired JPS5223218B2 (en) | 1974-02-13 | 1974-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5223218B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731857U (en) * | 1980-07-31 | 1982-02-19 | ||
| JP2012134534A (en) * | 2006-05-25 | 2012-07-12 | Taiwan Semiconductor Manufacturing Co Ltd | Method and system for composite bond wire |
-
1974
- 1974-02-13 JP JP49017359A patent/JPS5223218B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731857U (en) * | 1980-07-31 | 1982-02-19 | ||
| JP2012134534A (en) * | 2006-05-25 | 2012-07-12 | Taiwan Semiconductor Manufacturing Co Ltd | Method and system for composite bond wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5223218B2 (en) | 1977-06-22 |