JPS50109596A - - Google Patents

Info

Publication number
JPS50109596A
JPS50109596A JP1457874A JP1457874A JPS50109596A JP S50109596 A JPS50109596 A JP S50109596A JP 1457874 A JP1457874 A JP 1457874A JP 1457874 A JP1457874 A JP 1457874A JP S50109596 A JPS50109596 A JP S50109596A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1457874A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1457874A priority Critical patent/JPS50109596A/ja
Publication of JPS50109596A publication Critical patent/JPS50109596A/ja
Pending legal-status Critical Current

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Landscapes

  • Welding Or Cutting Using Electron Beams (AREA)
  • Physical Vapour Deposition (AREA)
JP1457874A 1974-02-06 1974-02-06 Pending JPS50109596A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1457874A JPS50109596A (fr) 1974-02-06 1974-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1457874A JPS50109596A (fr) 1974-02-06 1974-02-06

Publications (1)

Publication Number Publication Date
JPS50109596A true JPS50109596A (fr) 1975-08-28

Family

ID=11865031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1457874A Pending JPS50109596A (fr) 1974-02-06 1974-02-06

Country Status (1)

Country Link
JP (1) JPS50109596A (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648132A (en) * 1979-09-14 1981-05-01 Eaton Corp Method and device for thermally conducting vacuum coated article to be treated
JPS58194240A (ja) * 1982-05-10 1983-11-12 Nisshin Haiboruteeji Kk イオン注入装置のタ−ゲツト冷却装置
JPS605540A (ja) * 1979-03-16 1985-01-12 バリアン・アソシエイツ・インコ−ポレイテツド 半導体ウエ−フアの真空処理装置
US4832781A (en) * 1988-01-07 1989-05-23 Varian Associates, Inc. Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum
US4938992A (en) * 1988-01-07 1990-07-03 Varian Associates, Inc. Methods for thermal transfer with a semiconductor
US4997606A (en) * 1988-01-07 1991-03-05 Varian Associates, Inc. Methods and apparatus for fabricating a high purity thermally-conductive polymer layer
GB2347522A (en) * 1999-03-02 2000-09-06 Nec Corp Method and apparatus for process control of semiconductor fabrication

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS466674A (en) * 1970-05-15 1971-12-13 Texas Instruments Inc Electronic safety system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS466674A (en) * 1970-05-15 1971-12-13 Texas Instruments Inc Electronic safety system

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605540A (ja) * 1979-03-16 1985-01-12 バリアン・アソシエイツ・インコ−ポレイテツド 半導体ウエ−フアの真空処理装置
JPS6323616B2 (fr) * 1979-03-16 1988-05-17 Varian Associates
JPS5648132A (en) * 1979-09-14 1981-05-01 Eaton Corp Method and device for thermally conducting vacuum coated article to be treated
JPH0227778B2 (fr) * 1979-09-14 1990-06-19 Eaton Corp
JPS58194240A (ja) * 1982-05-10 1983-11-12 Nisshin Haiboruteeji Kk イオン注入装置のタ−ゲツト冷却装置
JPS6322409B2 (fr) * 1982-05-10 1988-05-11 Nitsushin Haiboruteeji Kk
US4832781A (en) * 1988-01-07 1989-05-23 Varian Associates, Inc. Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum
US4938992A (en) * 1988-01-07 1990-07-03 Varian Associates, Inc. Methods for thermal transfer with a semiconductor
US4997606A (en) * 1988-01-07 1991-03-05 Varian Associates, Inc. Methods and apparatus for fabricating a high purity thermally-conductive polymer layer
GB2347522A (en) * 1999-03-02 2000-09-06 Nec Corp Method and apparatus for process control of semiconductor fabrication
GB2347522B (en) * 1999-03-02 2001-07-11 Nec Corp Method and apparatus for process control of semiconductor device fabrication line

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