JPS50107865A - - Google Patents
Info
- Publication number
- JPS50107865A JPS50107865A JP1186274A JP1186274A JPS50107865A JP S50107865 A JPS50107865 A JP S50107865A JP 1186274 A JP1186274 A JP 1186274A JP 1186274 A JP1186274 A JP 1186274A JP S50107865 A JPS50107865 A JP S50107865A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186274A JPS5229151B2 (da) | 1974-01-30 | 1974-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186274A JPS5229151B2 (da) | 1974-01-30 | 1974-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50107865A true JPS50107865A (da) | 1975-08-25 |
| JPS5229151B2 JPS5229151B2 (da) | 1977-07-30 |
Family
ID=11789524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1186274A Expired JPS5229151B2 (da) | 1974-01-30 | 1974-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5229151B2 (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63284840A (ja) * | 1987-05-15 | 1988-11-22 | Sanyo Electric Co Ltd | 混成集積回路 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57617A (en) * | 1980-06-02 | 1982-01-05 | Hitachi Ltd | Liquid crystal display device |
-
1974
- 1974-01-30 JP JP1186274A patent/JPS5229151B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63284840A (ja) * | 1987-05-15 | 1988-11-22 | Sanyo Electric Co Ltd | 混成集積回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5229151B2 (da) | 1977-07-30 |