JPS499675A - - Google Patents
Info
- Publication number
- JPS499675A JPS499675A JP5277872A JP5277872A JPS499675A JP S499675 A JPS499675 A JP S499675A JP 5277872 A JP5277872 A JP 5277872A JP 5277872 A JP5277872 A JP 5277872A JP S499675 A JPS499675 A JP S499675A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5277872A JPS5418365B2 (https=) | 1972-05-26 | 1972-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5277872A JPS5418365B2 (https=) | 1972-05-26 | 1972-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS499675A true JPS499675A (https=) | 1974-01-28 |
| JPS5418365B2 JPS5418365B2 (https=) | 1979-07-06 |
Family
ID=12924299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5277872A Expired JPS5418365B2 (https=) | 1972-05-26 | 1972-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5418365B2 (https=) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5342370A (en) * | 1976-09-29 | 1978-04-17 | Hitachi Chemical Co Ltd | Method of producing chemically plated printed circuit board stacking board |
| JPS53126879U (https=) * | 1977-03-16 | 1978-10-07 | ||
| JPS54112940A (en) * | 1978-02-22 | 1979-09-04 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminate |
| JPS5542839A (en) * | 1978-09-25 | 1980-03-26 | Toshiba Chem Corp | Manufacture of lamination layer for chemical plating |
| JPS5548028A (en) * | 1978-09-14 | 1980-04-05 | Fuji Seal Ind Co Ltd | Method of inserting soft cylindrical body flatly folded and its device |
| JPS6193401U (https=) * | 1984-11-26 | 1986-06-17 | ||
| WO2017179328A1 (ja) * | 2016-04-15 | 2017-10-19 | アルプス電気株式会社 | 部材、電気・電子部品、電気・電子機器、および部材の製造方法 |
-
1972
- 1972-05-26 JP JP5277872A patent/JPS5418365B2/ja not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5342370A (en) * | 1976-09-29 | 1978-04-17 | Hitachi Chemical Co Ltd | Method of producing chemically plated printed circuit board stacking board |
| JPS53126879U (https=) * | 1977-03-16 | 1978-10-07 | ||
| JPS54112940A (en) * | 1978-02-22 | 1979-09-04 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminate |
| JPS5548028A (en) * | 1978-09-14 | 1980-04-05 | Fuji Seal Ind Co Ltd | Method of inserting soft cylindrical body flatly folded and its device |
| JPS5542839A (en) * | 1978-09-25 | 1980-03-26 | Toshiba Chem Corp | Manufacture of lamination layer for chemical plating |
| JPS6193401U (https=) * | 1984-11-26 | 1986-06-17 | ||
| WO2017179328A1 (ja) * | 2016-04-15 | 2017-10-19 | アルプス電気株式会社 | 部材、電気・電子部品、電気・電子機器、および部材の製造方法 |
| CN109072437A (zh) * | 2016-04-15 | 2018-12-21 | 阿尔卑斯电气株式会社 | 构件、电气/电子部件、电气/电子设备以及构件的制造方法 |
| CN109072437B (zh) * | 2016-04-15 | 2021-04-23 | 阿尔卑斯阿尔派株式会社 | 构件、电气/电子部件、电气/电子设备以及构件的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5418365B2 (https=) | 1979-07-06 |