JPS499629A - - Google Patents

Info

Publication number
JPS499629A
JPS499629A JP47051660A JP5166072A JPS499629A JP S499629 A JPS499629 A JP S499629A JP 47051660 A JP47051660 A JP 47051660A JP 5166072 A JP5166072 A JP 5166072A JP S499629 A JPS499629 A JP S499629A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47051660A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47051660A priority Critical patent/JPS499629A/ja
Publication of JPS499629A publication Critical patent/JPS499629A/ja
Pending legal-status Critical Current

Links

JP47051660A 1972-05-26 1972-05-26 Pending JPS499629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47051660A JPS499629A (en) 1972-05-26 1972-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47051660A JPS499629A (en) 1972-05-26 1972-05-26

Publications (1)

Publication Number Publication Date
JPS499629A true JPS499629A (en) 1974-01-28

Family

ID=12893019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47051660A Pending JPS499629A (en) 1972-05-26 1972-05-26

Country Status (1)

Country Link
JP (1) JPS499629A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8277948B2 (en) * 2006-02-17 2012-10-02 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8277948B2 (en) * 2006-02-17 2012-10-02 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
US8501870B2 (en) 2006-02-17 2013-08-06 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
US8568891B2 (en) 2006-02-17 2013-10-29 Hitachi Chemical Company, Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

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