JPS499191A - - Google Patents
Info
- Publication number
- JPS499191A JPS499191A JP47046337A JP4633772A JPS499191A JP S499191 A JPS499191 A JP S499191A JP 47046337 A JP47046337 A JP 47046337A JP 4633772 A JP4633772 A JP 4633772A JP S499191 A JPS499191 A JP S499191A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Inorganic Insulating Materials (AREA)
- Glass Compositions (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47046337A JPS5134265B2 (en:Method) | 1972-05-12 | 1972-05-12 | |
| US00356441A US3837002A (en) | 1972-05-12 | 1973-05-02 | Glass mold semiconductor device |
| DE2323896A DE2323896C3 (de) | 1972-05-12 | 1973-05-11 | Halbleitergleichrichter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47046337A JPS5134265B2 (en:Method) | 1972-05-12 | 1972-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS499191A true JPS499191A (en:Method) | 1974-01-26 |
| JPS5134265B2 JPS5134265B2 (en:Method) | 1976-09-25 |
Family
ID=12744308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47046337A Expired JPS5134265B2 (en:Method) | 1972-05-12 | 1972-05-12 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3837002A (en:Method) |
| JP (1) | JPS5134265B2 (en:Method) |
| DE (1) | DE2323896C3 (en:Method) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535971A (en) * | 1976-07-06 | 1978-01-19 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5819125B2 (ja) * | 1976-08-11 | 1983-04-16 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JPS54978A (en) * | 1977-06-06 | 1979-01-06 | Hitachi Ltd | Semiconductor device of glass seal type |
| DE19728693C2 (de) * | 1997-07-04 | 1999-04-29 | Siemens Ag | Halbleitermodul |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2620598A (en) * | 1947-04-22 | 1952-12-09 | James A Jobling And Company Lt | Method of fabricating multi-component glass articles |
| BE557975A (en:Method) * | 1956-06-04 | 1957-11-30 | ||
| US3410705A (en) * | 1963-10-30 | 1968-11-12 | Tdk Electronics Co Ltd | Ceramic dielectrics |
| US3392312A (en) * | 1963-11-06 | 1968-07-09 | Carman Lab Inc | Glass encapsulated electronic devices |
| US3363150A (en) * | 1964-05-25 | 1968-01-09 | Gen Electric | Glass encapsulated double heat sink diode assembly |
| US3535133A (en) * | 1968-04-24 | 1970-10-20 | Transitron Electronic Corp | Alkali-free electronic glass and method of manufacture |
-
1972
- 1972-05-12 JP JP47046337A patent/JPS5134265B2/ja not_active Expired
-
1973
- 1973-05-02 US US00356441A patent/US3837002A/en not_active Expired - Lifetime
- 1973-05-11 DE DE2323896A patent/DE2323896C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2323896A1 (de) | 1973-12-13 |
| DE2323896B2 (de) | 1977-09-29 |
| US3837002A (en) | 1974-09-17 |
| JPS5134265B2 (en:Method) | 1976-09-25 |
| DE2323896C3 (de) | 1978-08-31 |