JPS4990893A - - Google Patents

Info

Publication number
JPS4990893A
JPS4990893A JP199773A JP199773A JPS4990893A JP S4990893 A JPS4990893 A JP S4990893A JP 199773 A JP199773 A JP 199773A JP 199773 A JP199773 A JP 199773A JP S4990893 A JPS4990893 A JP S4990893A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP199773A
Other languages
Japanese (ja)
Other versions
JPS5632796B2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP731997A priority Critical patent/JPS5632796B2/ja
Publication of JPS4990893A publication Critical patent/JPS4990893A/ja
Publication of JPS5632796B2 publication Critical patent/JPS5632796B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP731997A 1972-12-28 1972-12-28 Expired JPS5632796B2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP731997A JPS5632796B2 (https=) 1972-12-28 1972-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP731997A JPS5632796B2 (https=) 1972-12-28 1972-12-28

Publications (2)

Publication Number Publication Date
JPS4990893A true JPS4990893A (https=) 1974-08-30
JPS5632796B2 JPS5632796B2 (https=) 1981-07-30

Family

ID=11517078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP731997A Expired JPS5632796B2 (https=) 1972-12-28 1972-12-28

Country Status (1)

Country Link
JP (1) JPS5632796B2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881U (https=) * 1972-05-11 1974-02-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881U (https=) * 1972-05-11 1974-02-02

Also Published As

Publication number Publication date
JPS5632796B2 (https=) 1981-07-30

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