JPS4989481A - - Google Patents
Info
- Publication number
- JPS4989481A JPS4989481A JP12956172A JP12956172A JPS4989481A JP S4989481 A JPS4989481 A JP S4989481A JP 12956172 A JP12956172 A JP 12956172A JP 12956172 A JP12956172 A JP 12956172A JP S4989481 A JPS4989481 A JP S4989481A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47129561A JPS5128980B2 (ja) | 1972-12-26 | 1972-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47129561A JPS5128980B2 (ja) | 1972-12-26 | 1972-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4989481A true JPS4989481A (ja) | 1974-08-27 |
JPS5128980B2 JPS5128980B2 (ja) | 1976-08-23 |
Family
ID=15012523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47129561A Expired JPS5128980B2 (ja) | 1972-12-26 | 1972-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5128980B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148358A (en) * | 1975-06-04 | 1976-12-20 | Raytheon Co | Integrated circuit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4512536Y1 (ja) * | 1967-07-19 | 1970-06-01 |
-
1972
- 1972-12-26 JP JP47129561A patent/JPS5128980B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4512536Y1 (ja) * | 1967-07-19 | 1970-06-01 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148358A (en) * | 1975-06-04 | 1976-12-20 | Raytheon Co | Integrated circuit |
JPS5850024B2 (ja) * | 1975-06-04 | 1983-11-08 | レイセオン カンパニ− | 集積回路装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5128980B2 (ja) | 1976-08-23 |