JPS498760A - - Google Patents
Info
- Publication number
- JPS498760A JPS498760A JP5072672A JP5072672A JPS498760A JP S498760 A JPS498760 A JP S498760A JP 5072672 A JP5072672 A JP 5072672A JP 5072672 A JP5072672 A JP 5072672A JP S498760 A JPS498760 A JP S498760A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072672A JPS5237586B2 (https=) | 1972-05-24 | 1972-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072672A JPS5237586B2 (https=) | 1972-05-24 | 1972-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS498760A true JPS498760A (https=) | 1974-01-25 |
| JPS5237586B2 JPS5237586B2 (https=) | 1977-09-22 |
Family
ID=12866852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5072672A Expired JPS5237586B2 (https=) | 1972-05-24 | 1972-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5237586B2 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5145762A (en) * | 1974-10-18 | 1976-04-19 | Matsushita Electric Industrial Co Ltd | Insatsudenkyokuhimaku |
| JPS54105772A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming electrode of thin film circuit |
| JPS57168235U (https=) * | 1981-04-20 | 1982-10-23 | ||
| JPS5858675U (ja) * | 1982-07-08 | 1983-04-20 | 富士通株式会社 | マルチ券発売機 |
| JPS6316444U (https=) * | 1986-07-18 | 1988-02-03 |
-
1972
- 1972-05-24 JP JP5072672A patent/JPS5237586B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5145762A (en) * | 1974-10-18 | 1976-04-19 | Matsushita Electric Industrial Co Ltd | Insatsudenkyokuhimaku |
| JPS54105772A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming electrode of thin film circuit |
| JPS57168235U (https=) * | 1981-04-20 | 1982-10-23 | ||
| JPS5858675U (ja) * | 1982-07-08 | 1983-04-20 | 富士通株式会社 | マルチ券発売機 |
| JPS6316444U (https=) * | 1986-07-18 | 1988-02-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5237586B2 (https=) | 1977-09-22 |