JPS498760A - - Google Patents

Info

Publication number
JPS498760A
JPS498760A JP5072672A JP5072672A JPS498760A JP S498760 A JPS498760 A JP S498760A JP 5072672 A JP5072672 A JP 5072672A JP 5072672 A JP5072672 A JP 5072672A JP S498760 A JPS498760 A JP S498760A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5072672A
Other languages
Japanese (ja)
Other versions
JPS5237586B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5072672A priority Critical patent/JPS5237586B2/ja
Publication of JPS498760A publication Critical patent/JPS498760A/ja
Publication of JPS5237586B2 publication Critical patent/JPS5237586B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP5072672A 1972-05-24 1972-05-24 Expired JPS5237586B2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5072672A JPS5237586B2 (en:Method) 1972-05-24 1972-05-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5072672A JPS5237586B2 (en:Method) 1972-05-24 1972-05-24

Publications (2)

Publication Number Publication Date
JPS498760A true JPS498760A (en:Method) 1974-01-25
JPS5237586B2 JPS5237586B2 (en:Method) 1977-09-22

Family

ID=12866852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5072672A Expired JPS5237586B2 (en:Method) 1972-05-24 1972-05-24

Country Status (1)

Country Link
JP (1) JPS5237586B2 (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145762A (en) * 1974-10-18 1976-04-19 Matsushita Electric Industrial Co Ltd Insatsudenkyokuhimaku
JPS54105772A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming electrode of thin film circuit
JPS57168235U (en:Method) * 1981-04-20 1982-10-23
JPS5858675U (ja) * 1982-07-08 1983-04-20 富士通株式会社 マルチ券発売機
JPS6316444U (en:Method) * 1986-07-18 1988-02-03

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145762A (en) * 1974-10-18 1976-04-19 Matsushita Electric Industrial Co Ltd Insatsudenkyokuhimaku
JPS54105772A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming electrode of thin film circuit
JPS57168235U (en:Method) * 1981-04-20 1982-10-23
JPS5858675U (ja) * 1982-07-08 1983-04-20 富士通株式会社 マルチ券発売機
JPS6316444U (en:Method) * 1986-07-18 1988-02-03

Also Published As

Publication number Publication date
JPS5237586B2 (en:Method) 1977-09-22

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