JPS498758A - - Google Patents
Info
- Publication number
- JPS498758A JPS498758A JP5072572A JP5072572A JPS498758A JP S498758 A JPS498758 A JP S498758A JP 5072572 A JP5072572 A JP 5072572A JP 5072572 A JP5072572 A JP 5072572A JP S498758 A JPS498758 A JP S498758A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072572A JPS498758A (xx) | 1972-05-24 | 1972-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072572A JPS498758A (xx) | 1972-05-24 | 1972-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS498758A true JPS498758A (xx) | 1974-01-25 |
Family
ID=12866826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5072572A Pending JPS498758A (xx) | 1972-05-24 | 1972-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS498758A (xx) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51133993U (xx) * | 1975-04-18 | 1976-10-28 | ||
| JPS51154892U (xx) * | 1975-06-03 | 1976-12-10 | ||
| JPS5226168A (en) * | 1975-08-22 | 1977-02-26 | Mitsubishi Electric Corp | Semi-conductor element |
-
1972
- 1972-05-24 JP JP5072572A patent/JPS498758A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51133993U (xx) * | 1975-04-18 | 1976-10-28 | ||
| JPS51154892U (xx) * | 1975-06-03 | 1976-12-10 | ||
| JPS5226168A (en) * | 1975-08-22 | 1977-02-26 | Mitsubishi Electric Corp | Semi-conductor element |