JPS4985967A - - Google Patents

Info

Publication number
JPS4985967A
JPS4985967A JP12822672A JP12822672A JPS4985967A JP S4985967 A JPS4985967 A JP S4985967A JP 12822672 A JP12822672 A JP 12822672A JP 12822672 A JP12822672 A JP 12822672A JP S4985967 A JPS4985967 A JP S4985967A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12822672A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12822672A priority Critical patent/JPS4985967A/ja
Publication of JPS4985967A publication Critical patent/JPS4985967A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Die Bonding (AREA)
JP12822672A 1972-12-22 1972-12-22 Pending JPS4985967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12822672A JPS4985967A (en) 1972-12-22 1972-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12822672A JPS4985967A (en) 1972-12-22 1972-12-22

Publications (1)

Publication Number Publication Date
JPS4985967A true JPS4985967A (en) 1974-08-17

Family

ID=14979601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12822672A Pending JPS4985967A (en) 1972-12-22 1972-12-22

Country Status (1)

Country Link
JP (1) JPS4985967A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349949A (en) * 1976-10-18 1978-05-06 Hitachi Ltd Pellet bonding method
JPS62202531A (en) * 1986-02-28 1987-09-07 Rohm Co Ltd Die bonding device for semiconductor pellet
JP2001161084A (en) * 1999-09-21 2001-06-12 Seiko Instruments Inc Direct-acting mechanism using ultrasonic motor and electronic device therewith
JP2008302394A (en) * 2007-06-08 2008-12-18 Robotech Co Ltd Vibration-type separation method for die-cast product, and device for the same method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349949A (en) * 1976-10-18 1978-05-06 Hitachi Ltd Pellet bonding method
JPS62202531A (en) * 1986-02-28 1987-09-07 Rohm Co Ltd Die bonding device for semiconductor pellet
JP2001161084A (en) * 1999-09-21 2001-06-12 Seiko Instruments Inc Direct-acting mechanism using ultrasonic motor and electronic device therewith
JP2008302394A (en) * 2007-06-08 2008-12-18 Robotech Co Ltd Vibration-type separation method for die-cast product, and device for the same method
JP4763653B2 (en) * 2007-06-08 2011-08-31 ロボテック株式会社 Vibratory separator for die casting products

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