JPS4985068U - - Google Patents
Info
- Publication number
- JPS4985068U JPS4985068U JP12888572U JP12888572U JPS4985068U JP S4985068 U JPS4985068 U JP S4985068U JP 12888572 U JP12888572 U JP 12888572U JP 12888572 U JP12888572 U JP 12888572U JP S4985068 U JPS4985068 U JP S4985068U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12888572U JPS4985068U (fr) | 1972-11-10 | 1972-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12888572U JPS4985068U (fr) | 1972-11-10 | 1972-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4985068U true JPS4985068U (fr) | 1974-07-23 |
Family
ID=28385565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12888572U Pending JPS4985068U (fr) | 1972-11-10 | 1972-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4985068U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161423A (ja) * | 1998-09-01 | 2010-07-22 | Philips Lumileds Lightng Co Llc | 発光半導体を備えた半導体装置 |
| JP2016086176A (ja) * | 1996-07-29 | 2016-05-19 | 日亜化学工業株式会社 | 発光装置と表示装置 |
-
1972
- 1972-11-10 JP JP12888572U patent/JPS4985068U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016086176A (ja) * | 1996-07-29 | 2016-05-19 | 日亜化学工業株式会社 | 発光装置と表示装置 |
| JP2010161423A (ja) * | 1998-09-01 | 2010-07-22 | Philips Lumileds Lightng Co Llc | 発光半導体を備えた半導体装置 |