JPS4984385A - - Google Patents

Info

Publication number
JPS4984385A
JPS4984385A JP12614072A JP12614072A JPS4984385A JP S4984385 A JPS4984385 A JP S4984385A JP 12614072 A JP12614072 A JP 12614072A JP 12614072 A JP12614072 A JP 12614072A JP S4984385 A JPS4984385 A JP S4984385A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12614072A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12614072A priority Critical patent/JPS4984385A/ja
Publication of JPS4984385A publication Critical patent/JPS4984385A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
JP12614072A 1972-12-18 1972-12-18 Pending JPS4984385A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12614072A JPS4984385A (fr) 1972-12-18 1972-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12614072A JPS4984385A (fr) 1972-12-18 1972-12-18

Publications (1)

Publication Number Publication Date
JPS4984385A true JPS4984385A (fr) 1974-08-13

Family

ID=14927649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12614072A Pending JPS4984385A (fr) 1972-12-18 1972-12-18

Country Status (1)

Country Link
JP (1) JPS4984385A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126288A (fr) * 1973-04-04 1974-12-03
JPS51124388A (en) * 1975-04-24 1976-10-29 Toshiba Corp Solid state light emitting display unit
JPS52137786U (fr) * 1976-04-15 1977-10-19
JPS52130294A (en) * 1976-04-24 1977-11-01 Oki Electric Ind Co Ltd Production of semiconductor device
JPS5725009U (fr) * 1980-07-21 1982-02-09
JPH10256605A (ja) * 1997-03-13 1998-09-25 Rohm Co Ltd 半導体発光素子
EP1021817A1 (fr) * 1997-07-14 2000-07-26 Hewlett-Packard Company Colorant fluorescent ajoute a l'epoxy d'une lentille de diode electroluminescente
JP2005072628A (ja) * 2004-12-13 2005-03-17 Rohm Co Ltd 半導体発光素子

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126288A (fr) * 1973-04-04 1974-12-03
JPS5325634B2 (fr) * 1973-04-04 1978-07-27
JPS51124388A (en) * 1975-04-24 1976-10-29 Toshiba Corp Solid state light emitting display unit
JPS52137786U (fr) * 1976-04-15 1977-10-19
JPS52130294A (en) * 1976-04-24 1977-11-01 Oki Electric Ind Co Ltd Production of semiconductor device
JPS5625033B2 (fr) * 1976-04-24 1981-06-10
JPS5725009U (fr) * 1980-07-21 1982-02-09
JPH10256605A (ja) * 1997-03-13 1998-09-25 Rohm Co Ltd 半導体発光素子
EP1021817A1 (fr) * 1997-07-14 2000-07-26 Hewlett-Packard Company Colorant fluorescent ajoute a l'epoxy d'une lentille de diode electroluminescente
EP1021817A4 (fr) * 1997-07-14 2005-08-03 Lumileds Lighting Us L L C Colorant fluorescent ajoute a l'epoxy d'une lentille de diode electroluminescente
JP2005072628A (ja) * 2004-12-13 2005-03-17 Rohm Co Ltd 半導体発光素子

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