JPS4983861A - - Google Patents

Info

Publication number
JPS4983861A
JPS4983861A JP12838772A JP12838772A JPS4983861A JP S4983861 A JPS4983861 A JP S4983861A JP 12838772 A JP12838772 A JP 12838772A JP 12838772 A JP12838772 A JP 12838772A JP S4983861 A JPS4983861 A JP S4983861A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12838772A
Other languages
Japanese (ja)
Other versions
JPS5517515B2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12838772A priority Critical patent/JPS5517515B2/ja
Publication of JPS4983861A publication Critical patent/JPS4983861A/ja
Publication of JPS5517515B2 publication Critical patent/JPS5517515B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP12838772A 1972-12-21 1972-12-21 Expired JPS5517515B2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12838772A JPS5517515B2 (fr) 1972-12-21 1972-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12838772A JPS5517515B2 (fr) 1972-12-21 1972-12-21

Publications (2)

Publication Number Publication Date
JPS4983861A true JPS4983861A (fr) 1974-08-12
JPS5517515B2 JPS5517515B2 (fr) 1980-05-12

Family

ID=14983542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12838772A Expired JPS5517515B2 (fr) 1972-12-21 1972-12-21

Country Status (1)

Country Link
JP (1) JPS5517515B2 (fr)

Also Published As

Publication number Publication date
JPS5517515B2 (fr) 1980-05-12

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