JPS4980184A - - Google Patents
Info
- Publication number
- JPS4980184A JPS4980184A JP11913872A JP11913872A JPS4980184A JP S4980184 A JPS4980184 A JP S4980184A JP 11913872 A JP11913872 A JP 11913872A JP 11913872 A JP11913872 A JP 11913872A JP S4980184 A JPS4980184 A JP S4980184A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11913872A JPS5038157B2 (enExample) | 1972-11-28 | 1972-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11913872A JPS5038157B2 (enExample) | 1972-11-28 | 1972-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4980184A true JPS4980184A (enExample) | 1974-08-02 |
| JPS5038157B2 JPS5038157B2 (enExample) | 1975-12-08 |
Family
ID=14753859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11913872A Expired JPS5038157B2 (enExample) | 1972-11-28 | 1972-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5038157B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4821148A (en) * | 1985-06-14 | 1989-04-11 | Hitachi, Ltd. | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound |
-
1972
- 1972-11-28 JP JP11913872A patent/JPS5038157B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4821148A (en) * | 1985-06-14 | 1989-04-11 | Hitachi, Ltd. | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5038157B2 (enExample) | 1975-12-08 |