JPS4979479A - - Google Patents
Info
- Publication number
- JPS4979479A JPS4979479A JP47121566A JP12156672A JPS4979479A JP S4979479 A JPS4979479 A JP S4979479A JP 47121566 A JP47121566 A JP 47121566A JP 12156672 A JP12156672 A JP 12156672A JP S4979479 A JPS4979479 A JP S4979479A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12156672A JPS5633864B2 (US20100170793A1-20100708-C00006.png) | 1972-12-06 | 1972-12-06 | |
US421651A US3920484A (en) | 1972-12-06 | 1973-12-04 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12156672A JPS5633864B2 (US20100170793A1-20100708-C00006.png) | 1972-12-06 | 1972-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4979479A true JPS4979479A (US20100170793A1-20100708-C00006.png) | 1974-07-31 |
JPS5633864B2 JPS5633864B2 (US20100170793A1-20100708-C00006.png) | 1981-08-06 |
Family
ID=14814393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12156672A Expired JPS5633864B2 (US20100170793A1-20100708-C00006.png) | 1972-12-06 | 1972-12-06 |
Country Status (2)
Country | Link |
---|---|
US (1) | US3920484A (US20100170793A1-20100708-C00006.png) |
JP (1) | JPS5633864B2 (US20100170793A1-20100708-C00006.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5190277A (en) * | 1975-02-05 | 1976-08-07 | Handotaisochino seizohoho | |
JPH01186673A (ja) * | 1988-01-14 | 1989-07-26 | Hitachi Ltd | 半導体装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2537559C3 (de) * | 1975-08-22 | 1978-05-03 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer monolithisch integrierten Halbleiterschaltung mit einem Junction-Feldeffekttransistor und einem komplementären MIS-Feldeffekttransistor |
EP0057549B1 (en) * | 1981-01-29 | 1987-07-29 | Kabushiki Kaisha Toshiba | Semiconductor device |
EP0067661A1 (en) * | 1981-06-15 | 1982-12-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
US5298462A (en) * | 1984-11-30 | 1994-03-29 | Robert Bosch Gmbh | Method of making metallization for semiconductor device |
KR890004420B1 (ko) * | 1986-11-04 | 1989-11-03 | 삼성반도체통신 주식회사 | 반도체 바이 씨 모오스장치의 제조방법 |
DE4303768C2 (de) * | 1992-02-14 | 1995-03-09 | Mitsubishi Electric Corp | Halbleitervorrichtung mit einem bipolaren Transistor und einem Feldeffekttransistor und Verfahren zu deren Herstellung |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609479A (en) * | 1968-02-29 | 1971-09-28 | Westinghouse Electric Corp | Semiconductor integrated circuit having mis and bipolar transistor elements |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3749610A (en) * | 1971-01-11 | 1973-07-31 | Itt | Production of silicon insulated gate and ion implanted field effect transistor |
US3756861A (en) * | 1972-03-13 | 1973-09-04 | Bell Telephone Labor Inc | Bipolar transistors and method of manufacture |
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1972
- 1972-12-06 JP JP12156672A patent/JPS5633864B2/ja not_active Expired
-
1973
- 1973-12-04 US US421651A patent/US3920484A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609479A (en) * | 1968-02-29 | 1971-09-28 | Westinghouse Electric Corp | Semiconductor integrated circuit having mis and bipolar transistor elements |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5190277A (en) * | 1975-02-05 | 1976-08-07 | Handotaisochino seizohoho | |
JPH01186673A (ja) * | 1988-01-14 | 1989-07-26 | Hitachi Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
US3920484A (en) | 1975-11-18 |
JPS5633864B2 (US20100170793A1-20100708-C00006.png) | 1981-08-06 |