JPS497777A - - Google Patents
Info
- Publication number
- JPS497777A JPS497777A JP4733272A JP4733272A JPS497777A JP S497777 A JPS497777 A JP S497777A JP 4733272 A JP4733272 A JP 4733272A JP 4733272 A JP4733272 A JP 4733272A JP S497777 A JPS497777 A JP S497777A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Conductors (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733272A JPS5229831B2 (en) | 1972-05-13 | 1972-05-13 | |
| AU55530/73A AU471519B2 (en) | 1972-05-13 | 1973-05-10 | Laminate tape and laminate sheath cable |
| FR7317228A FR2184765B1 (en) | 1972-05-13 | 1973-05-11 | |
| GB2269773A GB1411023A (en) | 1972-05-13 | 1973-05-11 | Laminated tape for sheathing cable |
| DE2324315A DE2324315B2 (en) | 1972-05-13 | 1973-05-14 | Coated metal tape and electrical jacket cable made with it |
| US05/359,944 US3935375A (en) | 1972-05-13 | 1973-05-14 | Laminate tape and laminate sheathed cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733272A JPS5229831B2 (en) | 1972-05-13 | 1972-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS497777A true JPS497777A (en) | 1974-01-23 |
| JPS5229831B2 JPS5229831B2 (en) | 1977-08-04 |
Family
ID=12772259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4733272A Expired JPS5229831B2 (en) | 1972-05-13 | 1972-05-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5229831B2 (en) |
| AU (1) | AU471519B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6645427B1 (en) | 1999-06-02 | 2003-11-11 | Honeywell International Inc. | Copper sputtering target assembly and method of making same |
| US6758920B2 (en) | 1999-11-24 | 2004-07-06 | Honeywell International Inc. | Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets |
| US6849139B2 (en) | 1999-06-02 | 2005-02-01 | Honeywell International Inc. | Methods of forming copper-containing sputtering targets |
-
1972
- 1972-05-13 JP JP4733272A patent/JPS5229831B2/ja not_active Expired
-
1973
- 1973-05-10 AU AU55530/73A patent/AU471519B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6645427B1 (en) | 1999-06-02 | 2003-11-11 | Honeywell International Inc. | Copper sputtering target assembly and method of making same |
| US6849139B2 (en) | 1999-06-02 | 2005-02-01 | Honeywell International Inc. | Methods of forming copper-containing sputtering targets |
| US6758920B2 (en) | 1999-11-24 | 2004-07-06 | Honeywell International Inc. | Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets |
| US6797079B2 (en) * | 1999-11-24 | 2004-09-28 | Honeywell International Inc. | Physical vapor deposition target |
Also Published As
| Publication number | Publication date |
|---|---|
| AU5553073A (en) | 1974-11-14 |
| JPS5229831B2 (en) | 1977-08-04 |
| AU471519B2 (en) | 1976-04-29 |