JPS497777A - - Google Patents

Info

Publication number
JPS497777A
JPS497777A JP4733272A JP4733272A JPS497777A JP S497777 A JPS497777 A JP S497777A JP 4733272 A JP4733272 A JP 4733272A JP 4733272 A JP4733272 A JP 4733272A JP S497777 A JPS497777 A JP S497777A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4733272A
Other languages
Japanese (ja)
Other versions
JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4733272A priority Critical patent/JPS5229831B2/ja
Priority to AU55530/73A priority patent/AU471519B2/en
Priority to GB2269773A priority patent/GB1411023A/en
Priority to FR7317228A priority patent/FR2184765B1/fr
Priority to DE2324315A priority patent/DE2324315B2/de
Priority to US05/359,944 priority patent/US3935375A/en
Publication of JPS497777A publication Critical patent/JPS497777A/ja
Publication of JPS5229831B2 publication Critical patent/JPS5229831B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
JP4733272A 1972-05-13 1972-05-13 Expired JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP4733272A JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-05-13 1972-05-13
AU55530/73A AU471519B2 (en) 1972-05-13 1973-05-10 Laminate tape and laminate sheath cable
GB2269773A GB1411023A (en) 1972-05-13 1973-05-11 Laminated tape for sheathing cable
FR7317228A FR2184765B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-05-13 1973-05-11
DE2324315A DE2324315B2 (de) 1972-05-13 1973-05-14 Beschichtetes Metallband und hiermit hergestelltes elektrisches Mantelkabel
US05/359,944 US3935375A (en) 1972-05-13 1973-05-14 Laminate tape and laminate sheathed cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4733272A JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-05-13 1972-05-13

Publications (2)

Publication Number Publication Date
JPS497777A true JPS497777A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-01-23
JPS5229831B2 JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-08-04

Family

ID=12772259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4733272A Expired JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-05-13 1972-05-13

Country Status (2)

Country Link
JP (1) JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU471519B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645427B1 (en) 1999-06-02 2003-11-11 Honeywell International Inc. Copper sputtering target assembly and method of making same
US6758920B2 (en) 1999-11-24 2004-07-06 Honeywell International Inc. Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets
US6849139B2 (en) 1999-06-02 2005-02-01 Honeywell International Inc. Methods of forming copper-containing sputtering targets

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645427B1 (en) 1999-06-02 2003-11-11 Honeywell International Inc. Copper sputtering target assembly and method of making same
US6849139B2 (en) 1999-06-02 2005-02-01 Honeywell International Inc. Methods of forming copper-containing sputtering targets
US6758920B2 (en) 1999-11-24 2004-07-06 Honeywell International Inc. Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets
US6797079B2 (en) * 1999-11-24 2004-09-28 Honeywell International Inc. Physical vapor deposition target

Also Published As

Publication number Publication date
AU471519B2 (en) 1976-04-29
AU5553073A (en) 1974-11-14
JPS5229831B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-08-04

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