JPS4977577A - - Google Patents
Info
- Publication number
- JPS4977577A JPS4977577A JP11811772A JP11811772A JPS4977577A JP S4977577 A JPS4977577 A JP S4977577A JP 11811772 A JP11811772 A JP 11811772A JP 11811772 A JP11811772 A JP 11811772A JP S4977577 A JPS4977577 A JP S4977577A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11811772A JPS5214144B2 (fi) | 1972-11-27 | 1972-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11811772A JPS5214144B2 (fi) | 1972-11-27 | 1972-11-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4977577A true JPS4977577A (fi) | 1974-07-26 |
| JPS5214144B2 JPS5214144B2 (fi) | 1977-04-19 |
Family
ID=14728437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11811772A Expired JPS5214144B2 (fi) | 1972-11-27 | 1972-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5214144B2 (fi) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293719U (fi) * | 1976-12-21 | 1977-07-13 | ||
| JPS5553436A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Wire bonding device |
-
1972
- 1972-11-27 JP JP11811772A patent/JPS5214144B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293719U (fi) * | 1976-12-21 | 1977-07-13 | ||
| JPS572464Y2 (fi) * | 1976-12-21 | 1982-01-16 | ||
| JPS5553436A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Wire bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5214144B2 (fi) | 1977-04-19 |