JPS4976468A - - Google Patents
Info
- Publication number
- JPS4976468A JPS4976468A JP11362272A JP11362272A JPS4976468A JP S4976468 A JPS4976468 A JP S4976468A JP 11362272 A JP11362272 A JP 11362272A JP 11362272 A JP11362272 A JP 11362272A JP S4976468 A JPS4976468 A JP S4976468A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Weting (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11362272A JPS573215B2 (en:Method) | 1972-11-13 | 1972-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11362272A JPS573215B2 (en:Method) | 1972-11-13 | 1972-11-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4976468A true JPS4976468A (en:Method) | 1974-07-23 |
| JPS573215B2 JPS573215B2 (en:Method) | 1982-01-20 |
Family
ID=14616868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11362272A Expired JPS573215B2 (en:Method) | 1972-11-13 | 1972-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS573215B2 (en:Method) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5250160A (en) * | 1975-10-20 | 1977-04-21 | Matsushita Electronics Corp | Processing method of semiconductor unit or semiconductor unit parts |
| JPS54104775A (en) * | 1978-02-03 | 1979-08-17 | Fuji Electric Co Ltd | Manufacture for semiconductor device |
| JPH05251557A (ja) * | 1992-03-04 | 1993-09-28 | Nec Corp | 半導体装置の製造方法 |
| JP2017056465A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社ディスコ | パッケージ基板の加工方法 |
| JP2017098452A (ja) * | 2015-11-26 | 2017-06-01 | 株式会社ディスコ | 洗浄方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0349516U (en:Method) * | 1989-09-22 | 1991-05-15 |
-
1972
- 1972-11-13 JP JP11362272A patent/JPS573215B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5250160A (en) * | 1975-10-20 | 1977-04-21 | Matsushita Electronics Corp | Processing method of semiconductor unit or semiconductor unit parts |
| JPS54104775A (en) * | 1978-02-03 | 1979-08-17 | Fuji Electric Co Ltd | Manufacture for semiconductor device |
| JPH05251557A (ja) * | 1992-03-04 | 1993-09-28 | Nec Corp | 半導体装置の製造方法 |
| JP2017056465A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社ディスコ | パッケージ基板の加工方法 |
| JP2017098452A (ja) * | 2015-11-26 | 2017-06-01 | 株式会社ディスコ | 洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS573215B2 (en:Method) | 1982-01-20 |