JPS4976244U - - Google Patents
Info
- Publication number
- JPS4976244U JPS4976244U JP12149172U JP12149172U JPS4976244U JP S4976244 U JPS4976244 U JP S4976244U JP 12149172 U JP12149172 U JP 12149172U JP 12149172 U JP12149172 U JP 12149172U JP S4976244 U JPS4976244 U JP S4976244U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12149172U JPS4976244U (sl) | 1972-10-23 | 1972-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12149172U JPS4976244U (sl) | 1972-10-23 | 1972-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4976244U true JPS4976244U (sl) | 1974-07-02 |
Family
ID=28364674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12149172U Pending JPS4976244U (sl) | 1972-10-23 | 1972-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4976244U (sl) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03117902A (ja) * | 1989-09-30 | 1991-05-20 | Taiyo Yuden Co Ltd | 電子部品の導電ペースト塗布方法及びその装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3357856A (en) * | 1964-02-13 | 1967-12-12 | Electra Mfg Company | Method for metallizing openings in miniature printed circuit wafers |
JPS509344A (sl) * | 1973-05-22 | 1975-01-30 |
-
1972
- 1972-10-23 JP JP12149172U patent/JPS4976244U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3357856A (en) * | 1964-02-13 | 1967-12-12 | Electra Mfg Company | Method for metallizing openings in miniature printed circuit wafers |
JPS509344A (sl) * | 1973-05-22 | 1975-01-30 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03117902A (ja) * | 1989-09-30 | 1991-05-20 | Taiyo Yuden Co Ltd | 電子部品の導電ペースト塗布方法及びその装置 |