JPS4975275A - - Google Patents
Info
- Publication number
- JPS4975275A JPS4975275A JP47117365A JP11736572A JPS4975275A JP S4975275 A JPS4975275 A JP S4975275A JP 47117365 A JP47117365 A JP 47117365A JP 11736572 A JP11736572 A JP 11736572A JP S4975275 A JPS4975275 A JP S4975275A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47117365A JPS4975275A (enrdf_load_stackoverflow) | 1972-11-22 | 1972-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47117365A JPS4975275A (enrdf_load_stackoverflow) | 1972-11-22 | 1972-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4975275A true JPS4975275A (enrdf_load_stackoverflow) | 1974-07-19 |
Family
ID=14709851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47117365A Pending JPS4975275A (enrdf_load_stackoverflow) | 1972-11-22 | 1972-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4975275A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52130566A (en) * | 1976-04-27 | 1977-11-01 | Mitsubishi Electric Corp | Sealing method for integrated circuit |
| JPS58219750A (ja) * | 1982-06-15 | 1983-12-21 | Mitsubishi Electric Corp | 半導体装置の封止方法 |
-
1972
- 1972-11-22 JP JP47117365A patent/JPS4975275A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52130566A (en) * | 1976-04-27 | 1977-11-01 | Mitsubishi Electric Corp | Sealing method for integrated circuit |
| JPS58219750A (ja) * | 1982-06-15 | 1983-12-21 | Mitsubishi Electric Corp | 半導体装置の封止方法 |