JPS49751B1 - - Google Patents
Info
- Publication number
- JPS49751B1 JPS49751B1 JP2919768A JP2919768A JPS49751B1 JP S49751 B1 JPS49751 B1 JP S49751B1 JP 2919768 A JP2919768 A JP 2919768A JP 2919768 A JP2919768 A JP 2919768A JP S49751 B1 JPS49751 B1 JP S49751B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/66—Joining insulating bodies together, e.g. by bonding
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/044—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63588367A | 1967-05-03 | 1967-05-03 | |
US63588467A | 1967-05-03 | 1967-05-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS49751B1 true JPS49751B1 (ja) | 1974-01-09 |
Family
ID=27092474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2919768A Pending JPS49751B1 (ja) | 1967-05-03 | 1968-05-02 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS49751B1 (ja) |
DE (1) | DE1771296A1 (ja) |
GB (1) | GB1179535A (ja) |
NL (1) | NL6806310A (ja) |
SE (1) | SE336042B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1979000783A1 (en) * | 1978-03-17 | 1979-10-18 | Hitachi Ltd | Semiconductor pressure sensors having a plurality of pressure-sensitive diaphragms and method of manufacturing the same |
JP2017506429A (ja) * | 2014-02-05 | 2017-03-02 | マイクロン テクノロジー, インク. | 静電力による半導体ボンディング強化用のデバイス、システムおよび方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3436001A1 (de) * | 1984-10-01 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrostatisches glasloeten von halbleiterbauteilen |
DE3937529A1 (de) * | 1989-11-08 | 1991-05-16 | Siemens Ag | Verfahren zum verbinden eines siliziumteiles mit einem glasteil |
-
1968
- 1968-04-30 SE SE588068A patent/SE336042B/xx unknown
- 1968-05-02 JP JP2919768A patent/JPS49751B1/ja active Pending
- 1968-05-02 DE DE19681771296 patent/DE1771296A1/de active Pending
- 1968-05-03 GB GB2109868A patent/GB1179535A/en not_active Expired
- 1968-05-03 NL NL6806310A patent/NL6806310A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1979000783A1 (en) * | 1978-03-17 | 1979-10-18 | Hitachi Ltd | Semiconductor pressure sensors having a plurality of pressure-sensitive diaphragms and method of manufacturing the same |
JP2017506429A (ja) * | 2014-02-05 | 2017-03-02 | マイクロン テクノロジー, インク. | 静電力による半導体ボンディング強化用のデバイス、システムおよび方法 |
Also Published As
Publication number | Publication date |
---|---|
DE1771296A1 (de) | 1971-12-23 |
SE336042B (ja) | 1971-06-21 |
GB1179535A (en) | 1970-01-28 |
NL6806310A (ja) | 1968-11-04 |