JPS4972160A - - Google Patents

Info

Publication number
JPS4972160A
JPS4972160A JP11294872A JP11294872A JPS4972160A JP S4972160 A JPS4972160 A JP S4972160A JP 11294872 A JP11294872 A JP 11294872A JP 11294872 A JP11294872 A JP 11294872A JP S4972160 A JPS4972160 A JP S4972160A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11294872A
Other languages
Japanese (ja)
Other versions
JPS527424B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11294872A priority Critical patent/JPS527424B2/ja
Publication of JPS4972160A publication Critical patent/JPS4972160A/ja
Publication of JPS527424B2 publication Critical patent/JPS527424B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
JP11294872A 1972-11-13 1972-11-13 Expired JPS527424B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11294872A JPS527424B2 (en) 1972-11-13 1972-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11294872A JPS527424B2 (en) 1972-11-13 1972-11-13

Publications (2)

Publication Number Publication Date
JPS4972160A true JPS4972160A (en) 1974-07-12
JPS527424B2 JPS527424B2 (en) 1977-03-02

Family

ID=14599513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11294872A Expired JPS527424B2 (en) 1972-11-13 1972-11-13

Country Status (1)

Country Link
JP (1) JPS527424B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351920B2 (en) 2002-05-22 2008-04-01 Kabushiki Kaisha Toshiba IC card and semiconductor integrated circuit device package

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018061755A1 (en) 2016-09-27 2018-04-05 株式会社 資生堂 Cosmetic raw material using core-corona type microparticles and oil-in-water type emulsion cosmetic
EP3530264A4 (en) 2016-10-20 2020-07-01 Shiseido Company, Ltd. Oil-in-water-type emulsion composition
JP7356998B2 (en) 2018-10-09 2023-10-05 株式会社 資生堂 Water-in-oil emulsion composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351920B2 (en) 2002-05-22 2008-04-01 Kabushiki Kaisha Toshiba IC card and semiconductor integrated circuit device package
US7531757B2 (en) 2002-05-22 2009-05-12 Kabushiki Kaisha Toshiba IC card and semiconductor integrated circuit device package

Also Published As

Publication number Publication date
JPS527424B2 (en) 1977-03-02

Similar Documents

Publication Publication Date Title
FR2188298A1 (en)
JPS4896301U (en)
CH574329A5 (en)
BG18514A1 (en)
BG20380A3 (en)
BG20575A3 (en)
BG20609A3 (en)
BG21095A1 (en)
BG21183A3 (en)
BG21223A3 (en)
BG21392A3 (en)
BG21461A1 (en)
BG22201A1 (en)
BG22277A1 (en)
CH545744A (en)
CH554968A (en)
CH559260A5 (en)
CH559379A5 (en)
CH559433A5 (en)
CH561414A5 (en)
CH562124A5 (en)
CH564724A5 (en)
CH565494A5 (en)
CH566910A5 (en)
CH567054A5 (en)