JPS4971457A - - Google Patents

Info

Publication number
JPS4971457A
JPS4971457A JP47113881A JP11388172A JPS4971457A JP S4971457 A JPS4971457 A JP S4971457A JP 47113881 A JP47113881 A JP 47113881A JP 11388172 A JP11388172 A JP 11388172A JP S4971457 A JPS4971457 A JP S4971457A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47113881A
Other languages
Japanese (ja)
Other versions
JPS5648968B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11388172A priority Critical patent/JPS5648968B2/ja
Priority to DE19732356856 priority patent/DE2356856C3/de
Publication of JPS4971457A publication Critical patent/JPS4971457A/ja
Publication of JPS5648968B2 publication Critical patent/JPS5648968B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP11388172A 1972-11-15 1972-11-15 Expired JPS5648968B2 (cg-RX-API-DMAC7.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11388172A JPS5648968B2 (cg-RX-API-DMAC7.html) 1972-11-15 1972-11-15
DE19732356856 DE2356856C3 (de) 1972-11-15 1973-11-14 Epoxyharz-Zubereitung und Verfahren zum Schützen von elektronischen Bauteilen unter Verwendung der Zubereitung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11388172A JPS5648968B2 (cg-RX-API-DMAC7.html) 1972-11-15 1972-11-15

Publications (2)

Publication Number Publication Date
JPS4971457A true JPS4971457A (cg-RX-API-DMAC7.html) 1974-07-10
JPS5648968B2 JPS5648968B2 (cg-RX-API-DMAC7.html) 1981-11-19

Family

ID=14623446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11388172A Expired JPS5648968B2 (cg-RX-API-DMAC7.html) 1972-11-15 1972-11-15

Country Status (1)

Country Link
JP (1) JPS5648968B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252570U (cg-RX-API-DMAC7.html) * 1985-09-21 1987-04-01
JPS6282881U (cg-RX-API-DMAC7.html) * 1985-11-14 1987-05-27
JPS6445587U (cg-RX-API-DMAC7.html) * 1987-09-16 1989-03-20

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4872246A (cg-RX-API-DMAC7.html) * 1971-11-01 1973-09-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4872246A (cg-RX-API-DMAC7.html) * 1971-11-01 1973-09-29

Also Published As

Publication number Publication date
JPS5648968B2 (cg-RX-API-DMAC7.html) 1981-11-19
DE2356856A1 (de) 1974-05-22
DE2356856B2 (de) 1976-07-29

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