JPS4970858U - - Google Patents
Info
- Publication number
- JPS4970858U JPS4970858U JP1972114649U JP11464972U JPS4970858U JP S4970858 U JPS4970858 U JP S4970858U JP 1972114649 U JP1972114649 U JP 1972114649U JP 11464972 U JP11464972 U JP 11464972U JP S4970858 U JPS4970858 U JP S4970858U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972114649U JPS4970858U (enExample) | 1972-10-04 | 1972-10-04 | |
| DE19732349545 DE2349545A1 (de) | 1972-10-04 | 1973-10-02 | Halbleiterdiode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972114649U JPS4970858U (enExample) | 1972-10-04 | 1972-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4970858U true JPS4970858U (enExample) | 1974-06-20 |
Family
ID=28345472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972114649U Pending JPS4970858U (enExample) | 1972-10-04 | 1972-10-04 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS4970858U (enExample) |
| DE (1) | DE2349545A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3996602A (en) * | 1975-08-14 | 1976-12-07 | General Instrument Corporation | Passivated and encapsulated semiconductors and method of making same |
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
-
1972
- 1972-10-04 JP JP1972114649U patent/JPS4970858U/ja active Pending
-
1973
- 1973-10-02 DE DE19732349545 patent/DE2349545A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2349545A1 (de) | 1974-04-18 |