JPS4969078A - - Google Patents

Info

Publication number
JPS4969078A
JPS4969078A JP11115472A JP11115472A JPS4969078A JP S4969078 A JPS4969078 A JP S4969078A JP 11115472 A JP11115472 A JP 11115472A JP 11115472 A JP11115472 A JP 11115472A JP S4969078 A JPS4969078 A JP S4969078A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11115472A
Other languages
Japanese (ja)
Other versions
JPS5116293B2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11115472A priority Critical patent/JPS5116293B2/ja
Publication of JPS4969078A publication Critical patent/JPS4969078A/ja
Publication of JPS5116293B2 publication Critical patent/JPS5116293B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201Structure
    • H01L2224/32012Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad

Landscapes

  • Die Bonding (AREA)
JP11115472A 1972-11-08 1972-11-08 Expired JPS5116293B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11115472A JPS5116293B2 (cs) 1972-11-08 1972-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11115472A JPS5116293B2 (cs) 1972-11-08 1972-11-08

Publications (2)

Publication Number Publication Date
JPS4969078A true JPS4969078A (cs) 1974-07-04
JPS5116293B2 JPS5116293B2 (cs) 1976-05-22

Family

ID=14553821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11115472A Expired JPS5116293B2 (cs) 1972-11-08 1972-11-08

Country Status (1)

Country Link
JP (1) JPS5116293B2 (cs)

Also Published As

Publication number Publication date
JPS5116293B2 (cs) 1976-05-22

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