JPS4967948U - - Google Patents

Info

Publication number
JPS4967948U
JPS4967948U JP1972111538U JP11153872U JPS4967948U JP S4967948 U JPS4967948 U JP S4967948U JP 1972111538 U JP1972111538 U JP 1972111538U JP 11153872 U JP11153872 U JP 11153872U JP S4967948 U JPS4967948 U JP S4967948U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972111538U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972111538U priority Critical patent/JPS4967948U/ja
Publication of JPS4967948U publication Critical patent/JPS4967948U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Connection Of Plates (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP1972111538U 1972-09-26 1972-09-26 Pending JPS4967948U (pl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972111538U JPS4967948U (pl) 1972-09-26 1972-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972111538U JPS4967948U (pl) 1972-09-26 1972-09-26

Publications (1)

Publication Number Publication Date
JPS4967948U true JPS4967948U (pl) 1974-06-13

Family

ID=28336757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972111538U Pending JPS4967948U (pl) 1972-09-26 1972-09-26

Country Status (1)

Country Link
JP (1) JPS4967948U (pl)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236685A (ja) * 1988-03-17 1989-09-21 Ibiden Co Ltd 電子部品搭載用基板
JPH0244370U (pl) * 1988-09-20 1990-03-27
JPH0383391A (ja) * 1989-08-28 1991-04-09 Matsushita Electric Ind Co Ltd 電子回路装置
JP2000340910A (ja) * 1999-03-24 2000-12-08 Furukawa Electric Co Ltd:The 金属ベース配線板及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236685A (ja) * 1988-03-17 1989-09-21 Ibiden Co Ltd 電子部品搭載用基板
JPH0244370U (pl) * 1988-09-20 1990-03-27
JPH0383391A (ja) * 1989-08-28 1991-04-09 Matsushita Electric Ind Co Ltd 電子回路装置
JP2000340910A (ja) * 1999-03-24 2000-12-08 Furukawa Electric Co Ltd:The 金属ベース配線板及びその製造方法

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