JPS4966359U - - Google Patents

Info

Publication number
JPS4966359U
JPS4966359U JP1972110676U JP11067672U JPS4966359U JP S4966359 U JPS4966359 U JP S4966359U JP 1972110676 U JP1972110676 U JP 1972110676U JP 11067672 U JP11067672 U JP 11067672U JP S4966359 U JPS4966359 U JP S4966359U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1972110676U
Other languages
Japanese (ja)
Other versions
JPS558277Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972110676U priority Critical patent/JPS558277Y2/ja
Publication of JPS4966359U publication Critical patent/JPS4966359U/ja
Application granted granted Critical
Publication of JPS558277Y2 publication Critical patent/JPS558277Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1972110676U 1972-09-21 1972-09-21 Expired JPS558277Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972110676U JPS558277Y2 (enrdf_load_html_response) 1972-09-21 1972-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972110676U JPS558277Y2 (enrdf_load_html_response) 1972-09-21 1972-09-21

Publications (2)

Publication Number Publication Date
JPS4966359U true JPS4966359U (enrdf_load_html_response) 1974-06-10
JPS558277Y2 JPS558277Y2 (enrdf_load_html_response) 1980-02-23

Family

ID=28334339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972110676U Expired JPS558277Y2 (enrdf_load_html_response) 1972-09-21 1972-09-21

Country Status (1)

Country Link
JP (1) JPS558277Y2 (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420119Y1 (enrdf_load_html_response) * 1966-02-18 1969-08-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420119Y1 (enrdf_load_html_response) * 1966-02-18 1969-08-28

Also Published As

Publication number Publication date
JPS558277Y2 (enrdf_load_html_response) 1980-02-23

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