JPS4966278A - - Google Patents
Info
- Publication number
- JPS4966278A JPS4966278A JP10901472A JP10901472A JPS4966278A JP S4966278 A JPS4966278 A JP S4966278A JP 10901472 A JP10901472 A JP 10901472A JP 10901472 A JP10901472 A JP 10901472A JP S4966278 A JPS4966278 A JP S4966278A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10901472A JPS4966278A (en) | 1972-10-31 | 1972-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10901472A JPS4966278A (en) | 1972-10-31 | 1972-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4966278A true JPS4966278A (en) | 1974-06-27 |
Family
ID=14499371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10901472A Pending JPS4966278A (en) | 1972-10-31 | 1972-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4966278A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03184360A (en) * | 1989-12-13 | 1991-08-12 | Canon Inc | Manufacture of semiconductor device |
JP2006253402A (en) * | 2005-03-10 | 2006-09-21 | Nec Electronics Corp | Manufacturing method of semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3699644A (en) * | 1971-01-04 | 1972-10-24 | Sylvania Electric Prod | Method of dividing wafers |
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1972
- 1972-10-31 JP JP10901472A patent/JPS4966278A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3699644A (en) * | 1971-01-04 | 1972-10-24 | Sylvania Electric Prod | Method of dividing wafers |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03184360A (en) * | 1989-12-13 | 1991-08-12 | Canon Inc | Manufacture of semiconductor device |
JP2006253402A (en) * | 2005-03-10 | 2006-09-21 | Nec Electronics Corp | Manufacturing method of semiconductor device |