JPS4963964A - - Google Patents
Info
- Publication number
- JPS4963964A JPS4963964A JP10722172A JP10722172A JPS4963964A JP S4963964 A JPS4963964 A JP S4963964A JP 10722172 A JP10722172 A JP 10722172A JP 10722172 A JP10722172 A JP 10722172A JP S4963964 A JPS4963964 A JP S4963964A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10722172A JPS558835B2 (hu) | 1972-10-27 | 1972-10-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10722172A JPS558835B2 (hu) | 1972-10-27 | 1972-10-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4963964A true JPS4963964A (hu) | 1974-06-20 |
JPS558835B2 JPS558835B2 (hu) | 1980-03-06 |
Family
ID=14453547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10722172A Expired JPS558835B2 (hu) | 1972-10-27 | 1972-10-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558835B2 (hu) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615098A (en) * | 1979-07-18 | 1981-02-13 | Ngk Spark Plug Co | Low dielectric multilayer ceramic substrate |
JPH02229491A (ja) * | 1989-03-02 | 1990-09-12 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板の製造方法 |
JPH03241788A (ja) * | 1990-02-20 | 1991-10-28 | Matsushita Electric Ind Co Ltd | 多層基板 |
JPH0653652A (ja) * | 1991-03-14 | 1994-02-25 | Nec Corp | 多層セラミック配線基板とその製造方法 |
JP2001210959A (ja) * | 2000-01-27 | 2001-08-03 | Kanji Otsuka | 配線基板及びその製造方法 |
JP2002151854A (ja) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | 多層プリント配線板およびその製造方法 |
CN113053618A (zh) * | 2019-12-27 | 2021-06-29 | 株式会社村田制作所 | 层叠线圈部件 |
-
1972
- 1972-10-27 JP JP10722172A patent/JPS558835B2/ja not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615098A (en) * | 1979-07-18 | 1981-02-13 | Ngk Spark Plug Co | Low dielectric multilayer ceramic substrate |
JPH02229491A (ja) * | 1989-03-02 | 1990-09-12 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板の製造方法 |
JPH03241788A (ja) * | 1990-02-20 | 1991-10-28 | Matsushita Electric Ind Co Ltd | 多層基板 |
JPH0653652A (ja) * | 1991-03-14 | 1994-02-25 | Nec Corp | 多層セラミック配線基板とその製造方法 |
JP2001210959A (ja) * | 2000-01-27 | 2001-08-03 | Kanji Otsuka | 配線基板及びその製造方法 |
JP2002151854A (ja) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | 多層プリント配線板およびその製造方法 |
CN113053618A (zh) * | 2019-12-27 | 2021-06-29 | 株式会社村田制作所 | 层叠线圈部件 |
Also Published As
Publication number | Publication date |
---|---|
JPS558835B2 (hu) | 1980-03-06 |