JPS4963848U - - Google Patents

Info

Publication number
JPS4963848U
JPS4963848U JP1972107694U JP10769472U JPS4963848U JP S4963848 U JPS4963848 U JP S4963848U JP 1972107694 U JP1972107694 U JP 1972107694U JP 10769472 U JP10769472 U JP 10769472U JP S4963848 U JPS4963848 U JP S4963848U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972107694U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972107694U priority Critical patent/JPS4963848U/ja
Publication of JPS4963848U publication Critical patent/JPS4963848U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1972107694U 1972-09-18 1972-09-18 Pending JPS4963848U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972107694U JPS4963848U (cs) 1972-09-18 1972-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972107694U JPS4963848U (cs) 1972-09-18 1972-09-18

Publications (1)

Publication Number Publication Date
JPS4963848U true JPS4963848U (cs) 1974-06-04

Family

ID=28325983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972107694U Pending JPS4963848U (cs) 1972-09-18 1972-09-18

Country Status (1)

Country Link
JP (1) JPS4963848U (cs)

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