JPS4961963U - - Google Patents
Info
- Publication number
- JPS4961963U JPS4961963U JP1972107527U JP10752772U JPS4961963U JP S4961963 U JPS4961963 U JP S4961963U JP 1972107527 U JP1972107527 U JP 1972107527U JP 10752772 U JP10752772 U JP 10752772U JP S4961963 U JPS4961963 U JP S4961963U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972107527U JPS4961963U (enrdf_load_html_response) | 1972-09-13 | 1972-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972107527U JPS4961963U (enrdf_load_html_response) | 1972-09-13 | 1972-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4961963U true JPS4961963U (enrdf_load_html_response) | 1974-05-30 |
Family
ID=28325502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972107527U Pending JPS4961963U (enrdf_load_html_response) | 1972-09-13 | 1972-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4961963U (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592159U (ja) * | 1982-06-28 | 1984-01-09 | ロ−ム株式会社 | トランジスタ装置 |
| JPH05206160A (ja) * | 1992-09-17 | 1993-08-13 | Rohm Co Ltd | 抵抗内蔵トランジスタ |
-
1972
- 1972-09-13 JP JP1972107527U patent/JPS4961963U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592159U (ja) * | 1982-06-28 | 1984-01-09 | ロ−ム株式会社 | トランジスタ装置 |
| JPH05206160A (ja) * | 1992-09-17 | 1993-08-13 | Rohm Co Ltd | 抵抗内蔵トランジスタ |