JPS4961445U - - Google Patents

Info

Publication number
JPS4961445U
JPS4961445U JP1972104672U JP10467272U JPS4961445U JP S4961445 U JPS4961445 U JP S4961445U JP 1972104672 U JP1972104672 U JP 1972104672U JP 10467272 U JP10467272 U JP 10467272U JP S4961445 U JPS4961445 U JP S4961445U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972104672U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972104672U priority Critical patent/JPS4961445U/ja
Publication of JPS4961445U publication Critical patent/JPS4961445U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1972104672U 1972-09-07 1972-09-07 Pending JPS4961445U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972104672U JPS4961445U (OSRAM) 1972-09-07 1972-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972104672U JPS4961445U (OSRAM) 1972-09-07 1972-09-07

Publications (1)

Publication Number Publication Date
JPS4961445U true JPS4961445U (OSRAM) 1974-05-30

Family

ID=28317446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972104672U Pending JPS4961445U (OSRAM) 1972-09-07 1972-09-07

Country Status (1)

Country Link
JP (1) JPS4961445U (OSRAM)

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