JPS4960674U - - Google Patents

Info

Publication number
JPS4960674U
JPS4960674U JP10385772U JP10385772U JPS4960674U JP S4960674 U JPS4960674 U JP S4960674U JP 10385772 U JP10385772 U JP 10385772U JP 10385772 U JP10385772 U JP 10385772U JP S4960674 U JPS4960674 U JP S4960674U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10385772U
Other languages
Japanese (ja)
Other versions
JPS5318293Y2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10385772U priority Critical patent/JPS5318293Y2/ja
Publication of JPS4960674U publication Critical patent/JPS4960674U/ja
Application granted granted Critical
Publication of JPS5318293Y2 publication Critical patent/JPS5318293Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP10385772U 1972-09-05 1972-09-05 Expired JPS5318293Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10385772U JPS5318293Y2 (de) 1972-09-05 1972-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10385772U JPS5318293Y2 (de) 1972-09-05 1972-09-05

Publications (2)

Publication Number Publication Date
JPS4960674U true JPS4960674U (de) 1974-05-28
JPS5318293Y2 JPS5318293Y2 (de) 1978-05-16

Family

ID=28315134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10385772U Expired JPS5318293Y2 (de) 1972-09-05 1972-09-05

Country Status (1)

Country Link
JP (1) JPS5318293Y2 (de)

Also Published As

Publication number Publication date
JPS5318293Y2 (de) 1978-05-16

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