JPS4957368A - - Google Patents

Info

Publication number
JPS4957368A
JPS4957368A JP9904072A JP9904072A JPS4957368A JP S4957368 A JPS4957368 A JP S4957368A JP 9904072 A JP9904072 A JP 9904072A JP 9904072 A JP9904072 A JP 9904072A JP S4957368 A JPS4957368 A JP S4957368A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9904072A
Other languages
Japanese (ja)
Other versions
JPS5310659B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9904072A priority Critical patent/JPS5310659B2/ja
Publication of JPS4957368A publication Critical patent/JPS4957368A/ja
Publication of JPS5310659B2 publication Critical patent/JPS5310659B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9904072A 1972-10-04 1972-10-04 Expired JPS5310659B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9904072A JPS5310659B2 (enrdf_load_html_response) 1972-10-04 1972-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9904072A JPS5310659B2 (enrdf_load_html_response) 1972-10-04 1972-10-04

Publications (2)

Publication Number Publication Date
JPS4957368A true JPS4957368A (enrdf_load_html_response) 1974-06-04
JPS5310659B2 JPS5310659B2 (enrdf_load_html_response) 1978-04-15

Family

ID=14236332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9904072A Expired JPS5310659B2 (enrdf_load_html_response) 1972-10-04 1972-10-04

Country Status (1)

Country Link
JP (1) JPS5310659B2 (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (enrdf_load_html_response) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS51107070A (enrdf_load_html_response) * 1975-03-18 1976-09-22 Fujitsu Ltd
JPS5315066A (en) * 1976-07-28 1978-02-10 Shinko Electric Ind Co Method of manufacturing electronic parts package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2041968A (en) * 1934-05-16 1936-05-26 Brown Co. Manufacture of rubber-reenforced waterlaid webs of fiber
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2041968A (en) * 1934-05-16 1936-05-26 Brown Co. Manufacture of rubber-reenforced waterlaid webs of fiber
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (enrdf_load_html_response) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS51107070A (enrdf_load_html_response) * 1975-03-18 1976-09-22 Fujitsu Ltd
JPS5315066A (en) * 1976-07-28 1978-02-10 Shinko Electric Ind Co Method of manufacturing electronic parts package

Also Published As

Publication number Publication date
JPS5310659B2 (enrdf_load_html_response) 1978-04-15

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