JPS4956595A - - Google Patents
Info
- Publication number
- JPS4956595A JPS4956595A JP9816272A JP9816272A JPS4956595A JP S4956595 A JPS4956595 A JP S4956595A JP 9816272 A JP9816272 A JP 9816272A JP 9816272 A JP9816272 A JP 9816272A JP S4956595 A JPS4956595 A JP S4956595A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9816272A JPS4956595A (enrdf_load_stackoverflow) | 1972-09-30 | 1972-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9816272A JPS4956595A (enrdf_load_stackoverflow) | 1972-09-30 | 1972-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4956595A true JPS4956595A (enrdf_load_stackoverflow) | 1974-06-01 |
Family
ID=14212396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9816272A Pending JPS4956595A (enrdf_load_stackoverflow) | 1972-09-30 | 1972-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4956595A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187212A (ja) * | 2008-05-07 | 2008-08-14 | Sharp Corp | 面実装型発光素子 |
-
1972
- 1972-09-30 JP JP9816272A patent/JPS4956595A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187212A (ja) * | 2008-05-07 | 2008-08-14 | Sharp Corp | 面実装型発光素子 |