JPS495570A - - Google Patents
Info
- Publication number
- JPS495570A JPS495570A JP4411572A JP4411572A JPS495570A JP S495570 A JPS495570 A JP S495570A JP 4411572 A JP4411572 A JP 4411572A JP 4411572 A JP4411572 A JP 4411572A JP S495570 A JPS495570 A JP S495570A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4411572A JPS495570A (en) | 1972-05-02 | 1972-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4411572A JPS495570A (en) | 1972-05-02 | 1972-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS495570A true JPS495570A (en) | 1974-01-18 |
Family
ID=12682591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4411572A Pending JPS495570A (en) | 1972-05-02 | 1972-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS495570A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53146572A (en) * | 1977-03-22 | 1978-12-20 | Wacker Chemitronic | Method of bonding disks |
| JPS5578545A (en) * | 1978-12-11 | 1980-06-13 | Fujitsu Ltd | Manufacture of semiconductor |
| JPS55125000A (en) * | 1979-03-19 | 1980-09-26 | Sumitomo Heavy Industries | Beam chopper position stabilizer circuit |
| JPS59113637A (en) * | 1982-12-20 | 1984-06-30 | Disco Abrasive Sys Ltd | Vacuum tape bonder for wafer |
| JPS6080249A (en) * | 1983-10-07 | 1985-05-08 | Disco Abrasive Sys Ltd | Method and apparatus for applying adhesive tape on semiconductor wafer |
| WO2014057769A1 (en) * | 2012-10-12 | 2014-04-17 | 新東工業株式会社 | Depressurizing jig and method for pressurizing object by using depressurizing jig |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4034879Y1 (en) * | 1965-04-30 | 1965-12-08 |
-
1972
- 1972-05-02 JP JP4411572A patent/JPS495570A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4034879Y1 (en) * | 1965-04-30 | 1965-12-08 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53146572A (en) * | 1977-03-22 | 1978-12-20 | Wacker Chemitronic | Method of bonding disks |
| JPS5578545A (en) * | 1978-12-11 | 1980-06-13 | Fujitsu Ltd | Manufacture of semiconductor |
| JPS55125000A (en) * | 1979-03-19 | 1980-09-26 | Sumitomo Heavy Industries | Beam chopper position stabilizer circuit |
| JPS59113637A (en) * | 1982-12-20 | 1984-06-30 | Disco Abrasive Sys Ltd | Vacuum tape bonder for wafer |
| JPH0216583B2 (en) * | 1982-12-20 | 1990-04-17 | Disco Abrasive Systems Ltd | |
| JPS6080249A (en) * | 1983-10-07 | 1985-05-08 | Disco Abrasive Sys Ltd | Method and apparatus for applying adhesive tape on semiconductor wafer |
| WO2014057769A1 (en) * | 2012-10-12 | 2014-04-17 | 新東工業株式会社 | Depressurizing jig and method for pressurizing object by using depressurizing jig |
| JPWO2014057769A1 (en) * | 2012-10-12 | 2016-09-05 | 新東工業株式会社 | Depressurizing jig and pressurizing method of object to be pressurized using depressurizing jig |