|
EP0026741B1
(de)
*
|
1979-09-28 |
1983-05-25 |
GRETAG Aktiengesellschaft |
Messkopf für ein Densitometer
|
|
WO2014079478A1
(en)
*
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US10293436B2
(en)
|
2013-12-17 |
2019-05-21 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9815144B2
(en)
|
2014-07-08 |
2017-11-14 |
Corning Incorporated |
Methods and apparatuses for laser processing materials
|
|
US11648623B2
(en)
|
2014-07-14 |
2023-05-16 |
Corning Incorporated |
Systems and methods for processing transparent materials using adjustable laser beam focal lines
|
|
EP3169635B1
(en)
|
2014-07-14 |
2022-11-23 |
Corning Incorporated |
Method and system for forming perforations
|
|
EP3169476A1
(en)
|
2014-07-14 |
2017-05-24 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
US10335902B2
(en)
|
2014-07-14 |
2019-07-02 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
KR20170105562A
(ko)
|
2015-01-12 |
2017-09-19 |
코닝 인코포레이티드 |
다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
|
|
HUE055461T2
(hu)
|
2015-03-24 |
2021-11-29 |
Corning Inc |
Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
|
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
CN107835794A
(zh)
|
2015-07-10 |
2018-03-23 |
康宁股份有限公司 |
在挠性基材板中连续制造孔的方法和与此相关的产品
|
|
WO2017192835A1
(en)
|
2016-05-06 |
2017-11-09 |
Corning Incorporated |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
WO2018022476A1
(en)
|
2016-07-29 |
2018-02-01 |
Corning Incorporated |
Apparatuses and methods for laser processing
|
|
EP3507057A1
(en)
|
2016-08-30 |
2019-07-10 |
Corning Incorporated |
Laser processing of transparent materials
|
|
CN113399816B
(zh)
|
2016-09-30 |
2023-05-16 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
US11542190B2
(en)
|
2016-10-24 |
2023-01-03 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|