JPS4953377A - - Google Patents
Info
- Publication number
- JPS4953377A JPS4953377A JP9597572A JP9597572A JPS4953377A JP S4953377 A JPS4953377 A JP S4953377A JP 9597572 A JP9597572 A JP 9597572A JP 9597572 A JP9597572 A JP 9597572A JP S4953377 A JPS4953377 A JP S4953377A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9597572A JPS4953377A (sk) | 1972-09-25 | 1972-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9597572A JPS4953377A (sk) | 1972-09-25 | 1972-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4953377A true JPS4953377A (sk) | 1974-05-23 |
Family
ID=14152158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9597572A Pending JPS4953377A (sk) | 1972-09-25 | 1972-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4953377A (sk) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5165659U (sk) * | 1974-11-18 | 1976-05-24 | ||
| JPS52119953A (en) * | 1976-04-02 | 1977-10-07 | Hitachi Ltd | Displacement converter using semiconductor strain gauges |
| JPS56142633A (en) * | 1980-04-08 | 1981-11-07 | Mitsubishi Electric Corp | Forming method for back electrode of semiconductor wafer |
-
1972
- 1972-09-25 JP JP9597572A patent/JPS4953377A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5165659U (sk) * | 1974-11-18 | 1976-05-24 | ||
| JPS52119953A (en) * | 1976-04-02 | 1977-10-07 | Hitachi Ltd | Displacement converter using semiconductor strain gauges |
| JPS5611085B2 (sk) * | 1976-04-02 | 1981-03-12 | ||
| JPS56142633A (en) * | 1980-04-08 | 1981-11-07 | Mitsubishi Electric Corp | Forming method for back electrode of semiconductor wafer |