JPS4952989A - - Google Patents

Info

Publication number
JPS4952989A
JPS4952989A JP47094542A JP9454272A JPS4952989A JP S4952989 A JPS4952989 A JP S4952989A JP 47094542 A JP47094542 A JP 47094542A JP 9454272 A JP9454272 A JP 9454272A JP S4952989 A JPS4952989 A JP S4952989A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47094542A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47094542A priority Critical patent/JPS4952989A/ja
Publication of JPS4952989A publication Critical patent/JPS4952989A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP47094542A 1972-09-22 1972-09-22 Pending JPS4952989A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47094542A JPS4952989A (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47094542A JPS4952989A (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Publications (1)

Publication Number Publication Date
JPS4952989A true JPS4952989A (enrdf_load_stackoverflow) 1974-05-23

Family

ID=14113191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47094542A Pending JPS4952989A (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Country Status (1)

Country Link
JP (1) JPS4952989A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322669U (enrdf_load_stackoverflow) * 1976-08-05 1978-02-25
JPS5493382A (en) * 1977-12-30 1979-07-24 Toyo Dengu Seisakushiyo Kk Light emission device and method of fabricating same
JPS5737889A (en) * 1980-08-18 1982-03-02 Stanley Electric Co Ltd Production of light emitting diode
JPS59229884A (ja) * 1983-05-27 1984-12-24 Rohm Co Ltd 可視発光ダイオ−ドのモ−ルド方法
JPS60129161U (ja) * 1984-02-07 1985-08-30 三洋電機株式会社 光結合器
JPH04137075U (ja) * 1991-06-17 1992-12-21 株式会社ヨンマルゴ 光 源
JP2016213365A (ja) * 2015-05-12 2016-12-15 三菱電機株式会社 発光装置、表示装置、及び発光装置の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322669U (enrdf_load_stackoverflow) * 1976-08-05 1978-02-25
JPS5493382A (en) * 1977-12-30 1979-07-24 Toyo Dengu Seisakushiyo Kk Light emission device and method of fabricating same
JPS5737889A (en) * 1980-08-18 1982-03-02 Stanley Electric Co Ltd Production of light emitting diode
JPS59229884A (ja) * 1983-05-27 1984-12-24 Rohm Co Ltd 可視発光ダイオ−ドのモ−ルド方法
JPS60129161U (ja) * 1984-02-07 1985-08-30 三洋電機株式会社 光結合器
JPH04137075U (ja) * 1991-06-17 1992-12-21 株式会社ヨンマルゴ 光 源
JP2016213365A (ja) * 2015-05-12 2016-12-15 三菱電機株式会社 発光装置、表示装置、及び発光装置の製造方法

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