JPS4952974A - - Google Patents

Info

Publication number
JPS4952974A
JPS4952974A JP9452872A JP9452872A JPS4952974A JP S4952974 A JPS4952974 A JP S4952974A JP 9452872 A JP9452872 A JP 9452872A JP 9452872 A JP9452872 A JP 9452872A JP S4952974 A JPS4952974 A JP S4952974A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9452872A
Other languages
Japanese (ja)
Other versions
JPS523276B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9452872A priority Critical patent/JPS523276B2/ja
Publication of JPS4952974A publication Critical patent/JPS4952974A/ja
Publication of JPS523276B2 publication Critical patent/JPS523276B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9452872A 1972-09-22 1972-09-22 Expired JPS523276B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9452872A JPS523276B2 (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9452872A JPS523276B2 (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Publications (2)

Publication Number Publication Date
JPS4952974A true JPS4952974A (enrdf_load_stackoverflow) 1974-05-23
JPS523276B2 JPS523276B2 (enrdf_load_stackoverflow) 1977-01-27

Family

ID=14112818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9452872A Expired JPS523276B2 (enrdf_load_stackoverflow) 1972-09-22 1972-09-22

Country Status (1)

Country Link
JP (1) JPS523276B2 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114268A (ja) * 1974-07-26 1976-02-04 Matsushita Electronics Corp Shirikonhandotaisoshi no seizohoho
JPS53975A (en) * 1976-06-25 1978-01-07 Hitachi Ltd Glass-sealed type semiconductor device
JPS55137552U (enrdf_load_stackoverflow) * 1980-03-21 1980-09-30
JPS5917276A (ja) * 1982-07-20 1984-01-28 Hitachi Ltd 半導体装置
JPS6197858U (enrdf_load_stackoverflow) * 1984-12-04 1986-06-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114268A (ja) * 1974-07-26 1976-02-04 Matsushita Electronics Corp Shirikonhandotaisoshi no seizohoho
JPS53975A (en) * 1976-06-25 1978-01-07 Hitachi Ltd Glass-sealed type semiconductor device
JPS55137552U (enrdf_load_stackoverflow) * 1980-03-21 1980-09-30
JPS5917276A (ja) * 1982-07-20 1984-01-28 Hitachi Ltd 半導体装置
JPS6197858U (enrdf_load_stackoverflow) * 1984-12-04 1986-06-23

Also Published As

Publication number Publication date
JPS523276B2 (enrdf_load_stackoverflow) 1977-01-27

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