JPS495197B1 - - Google Patents
Info
- Publication number
- JPS495197B1 JPS495197B1 JP3272769A JP3272769A JPS495197B1 JP S495197 B1 JPS495197 B1 JP S495197B1 JP 3272769 A JP3272769 A JP 3272769A JP 3272769 A JP3272769 A JP 3272769A JP S495197 B1 JPS495197 B1 JP S495197B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3272769A JPS495197B1 (enExample) | 1969-04-28 | 1969-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3272769A JPS495197B1 (enExample) | 1969-04-28 | 1969-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS495197B1 true JPS495197B1 (enExample) | 1974-02-05 |
Family
ID=12366860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3272769A Pending JPS495197B1 (enExample) | 1969-04-28 | 1969-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS495197B1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5411500U (enExample) * | 1977-06-25 | 1979-01-25 | ||
| JPH02103892U (enExample) * | 1989-02-06 | 1990-08-17 | ||
| JP2024013124A (ja) * | 2022-07-19 | 2024-01-31 | 三菱電機株式会社 | 半導体モジュール及びその製造方法 |
-
1969
- 1969-04-28 JP JP3272769A patent/JPS495197B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5411500U (enExample) * | 1977-06-25 | 1979-01-25 | ||
| JPH02103892U (enExample) * | 1989-02-06 | 1990-08-17 | ||
| JP2024013124A (ja) * | 2022-07-19 | 2024-01-31 | 三菱電機株式会社 | 半導体モジュール及びその製造方法 |