JPS4951874A - - Google Patents

Info

Publication number
JPS4951874A
JPS4951874A JP47093601A JP9360172A JPS4951874A JP S4951874 A JPS4951874 A JP S4951874A JP 47093601 A JP47093601 A JP 47093601A JP 9360172 A JP9360172 A JP 9360172A JP S4951874 A JPS4951874 A JP S4951874A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47093601A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47093601A priority Critical patent/JPS4951874A/ja
Publication of JPS4951874A publication Critical patent/JPS4951874A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP47093601A 1972-09-20 1972-09-20 Pending JPS4951874A (en(2012))

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47093601A JPS4951874A (en(2012)) 1972-09-20 1972-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47093601A JPS4951874A (en(2012)) 1972-09-20 1972-09-20

Publications (1)

Publication Number Publication Date
JPS4951874A true JPS4951874A (en(2012)) 1974-05-20

Family

ID=14086827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47093601A Pending JPS4951874A (en(2012)) 1972-09-20 1972-09-20

Country Status (1)

Country Link
JP (1) JPS4951874A (en(2012))

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444869A (en) * 1978-08-21 1979-04-09 Hitachi Ltd Transistor
JPH0253609U (en(2012)) * 1988-10-07 1990-04-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444869A (en) * 1978-08-21 1979-04-09 Hitachi Ltd Transistor
JPH0253609U (en(2012)) * 1988-10-07 1990-04-18

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